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YAMAICHI IC测试及老化插座 IC测试座 IC芯片座 IC测试夹具集成电路插座

　

IC测试及老化插座 相关资料:表面贴装型IC测试及老化插座


Package	Type	Pitch (mm)	Pin count	Series	Description
	PS	1.27 to 2.54	40 &120 28 to 100 36 to 88 50 to 120 36	PS42-H PS44 PS43 PS61 PS42-D	180° through hole 180° through hole 180° through hole 180° through hole for general use 90° through hole for general use


Package	Type	Pitch (mm)	Pin count	Series	Description
	SIP	1.778	7 to 56	IC70	Single inline package
	SIMM		30 to 100	IC176	Single inline memory package
	ZIP	1.27 to1.78 1.27	12 to 60 20 to 40	IC39 IC182	Zig-Zag inline package Zig-Zag inline package


Package	Type	Pitch (mm)	Pin count	Series	Description
	DIMM	1.27 0.80 1.27 1.00 1.27 0.60 0.50	72 144 160 184 & 240 184 200 144 & 172	IC544 IC497 IC438 IC595 IC589 IC657 IC657	Duai inline memory module Dual inline memory module Dual inline memory module Dual inline memory module Dual inline memory module Dual inline memory module Dual inline memory module
	DIP	2.54	14 to 64	IC37	Dual inline package
	SDIP	1.778 1.778	20 to 64 28 to 90	IC76 IC121	Shrink dual inline package Shrink dual inline package
	SOJ	1.27 1.27	20 to 36 24 to 34	IC100 IC107	Small outline J-lead package -dead bug Small outline J-lead package -live bug
	SOP SSOP TSOP	0.6 to 1.27 0.50 0.8 & 1.27	8 to 48 24 to48 26 to50	IC51 IC51 IC51	Clamshell for SOP Clamshell for SSOP, Clamshell for TSOP (Type I and II)
	SOP/ SSOP/ TSOP	0.5 to 1.27	16 to 88	IC189	Open top for (type I and II)
	TSOP	0.50	32 to 56	IC191	Thin small outline package (type I)
	TSOP/ SOP	0.8 & 1.27 0.65 & 0.8	20 to 54 50 to 66	IC235	Thin small outline package (Type II and 8-pin SOP)
	TSOP	0.80	54	IC363 IC369	(Type II), 2-point contacts (Type II), 2-point contacts
	This PDF file (Click here) shows typical examples of pin postions for QFP and SO packages


Package	Type	Pitch (mm)	Pin count	Series	Description
	QFP	0.4 to 0.8	100, 144	IC402	Open top Shrinked QFP with 2-point contacts
	QFP/ PQFP/ TQFP MQUAD	0.5 to 1.0 0.50	32 to 304 208 to304	IC51	Clamshell quad flat packages Clamshell for MQUAD packages
	BQFP	0.635 0.635	100 to196 84 to 164	IC51 IC211	Clamshell for bumper quad flat package Open top for bumper quad flat package
	PLCC	1.27	100 to124	IC51	Clamshell for plastic lead chip carrier
	PLCC		18 to 84	IC120	Open top for plastic lead chip carrier
	LCC	0.5 to 1.00	20 to 124	IC51/53	Clamshell for leadless chip carrier
	TCP/TAB			IC51	Tape carrier package & tape automatic bonding
	QFP	0.5 to 1.00 0.4 to 0.8	44 to 304 32 to 256	IC200 / IC248 IC234	Open top for quad flat packages Open top for QFP with shoulder contacts
	This PDF file (Click here) shows typical examples of pin postions for QFP and SO packages


Package	Type	Pitch (mm)	Pin count	Series	Description
	PGA/ZIF	2.54 2.54 1.27 1.27	73 to 625 196 to 361 644 & 720 1020	NP89 NP161 NP178 NP236	Pin grid array / zero insertion force Pin grid array / zero insertion force Pin grid array / zero insertion force Pin grid array / zero insertion force
	BGA	1.50 1.27	225 89 to 1105	IC264 NP276	Open top - ball grid array Open top - ball grid array various grid sizes and depopuated versions available
	FBGA	1.00 0.80 0.75	48 to 1849 48 to 520 36 to 288	NP352 NP351 NP291	Open Top - fine ball grid array various grid sizes and depopuated versions available Open top - fine ball grid array various grid sizes and depopuated versions available Open top - fine ball grid array various grid sizes and depopuated versions available
	FBGA/ CSP	0.75 to 1.00	169 to 868	IC280	Clamshell - fine ball grid array various grid sizes and depopuated versions available
	CSP CSP CSP CSP	0.50 0.50 0.50 0.50	264 up to 324 Various Various	NP284 IC398 NP383 IC409	Open Top - chip scale package Open Top - chip scale package (various sizes) Open Top - chip scale package (various sizes) Clamshell - chip scale package (various sizes)


Package	Type	Pitch (mm)	Pin count	Series	Description
	Long Life High Frequency ECON	Any Any Any	Any Any Any	YED274 YED274 YED353 IC274 IC275 IC299	Test Contactors in SMT - Spring probe contacts for automatic / manual use Test Contactors in SMT - Spring probe contacts for automatic / manual use Test Contactors in SMT - Spring probe contacts for manual use SMT - Spring probe contacts for LGA, BGA, CSP TH - Spring probe contacts for LGA, BGA, CSP SMT - High Frequency Socket/Handler (Y-shaped contacts)
	Special			YED514 k	SMT - adapter socket with carrier for BGA


Package	Type	Pitch (mm)	Pin count	Series	Description
	All			Various	Design rules, contact types, notches & grooves

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