YAMAICHI  表面贴装型IC测试及老化插座 贴片测试座 YAMAICHI测试座 ENPLAS测试座

 表面贴装型IC测试及老化插座                                   相关资料:IC测试及老化插座

Package Type Pitch (mm) Pin count Series Description 　 DIP 2.54 2.54 1.778 16 to 40 20 32 IC136 IC196 IC233 SMT- fixing SMT- fixing SMT- shrink dip DIMM 1.27 1.27 　 168 168 　 CN031T CN031T 　 TH - with PCB metal clips TH - positioning pins to PCB 　 SOJ 1.27 1.27   IC170 IC170 SMT - identical footprint SMT - oversize footprint SOP 1.27 1.27 1.27 28 to 44 28 to 32 28 to 44 IC179 IC179 IC179 SMT - oversize footprint (design 1) SMT - identical footprint (design 3) SMT - identical footprint and narrow housing (design 5) TSOP 1.27 32 to 56 IC197 SMT - identical footprint (style200 / 210) Package Type Pitch (mm) Pin count Series Description QFP / TQFP / BQFP 0.40 to 1.00 44 to 272 　 IC149 Socket series overview 　 ICP 0.40 to 1.00 44 to 272 ICP-**-* ICP-ext - PDF only (27KB) Emulation adapter overview for IC149 Extenter for emulation adapter QFP 0.05 to 0.80 　 44 to 208 　 IC198 IC198/198A PDF only 61KB 　 Socket series overview Insertion and extraction tools LCC 0.5 to 1.27 0.80 32 to 160 80 only IC61 ICP Socket varations in SMT and TH Emulation adapter for IC61 series PLCC 1.27 1.27 28 to 84 20 to 84 IC113 IC160 TH - low profile SMT - 3 terminal style Package Type Pitch (mm) Pin count Series Description PGA 1.27 25 to 484 　 YED122 TH - solder dip and wire wrap terminals 　 SPGA 1.27 321 YED210 TH - interstitial SPGA / ZIF 2.54 　 370 　 NP210T-370 　 Interstitial - ZIF- Intel Celeron (370 pins) 　 BGA 1.27 and 1.50 any YED514 SMT - adapter socket with carrier for BGA                                以上产品资料版权均归日本YAMAICHI公司所有