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YAMAICHI  表面贴装型IC测试及老化插座 贴片测试座 YAMAICHI测试座 ENPLAS测试座
 

 表面贴装型IC测试及老化插座                                   相关资料:IC测试及老化插座

Package Type Pitch (mm) Pin count Series Description


 
DIP 2.54
2.54
1.778
16 to 40
20
32
IC136
IC196
IC233
SMT- fixing
SMT- fixing
SMT- shrink dip
DIMM 1.27
1.27
 
168
168
 
CN031T
CN031T
 
TH - with PCB metal clips
TH - positioning pins to PCB
 
SOJ 1.27
1.27
  IC170
IC170
SMT - identical footprint
SMT - oversize footprint
SOP 1.27
1.27
1.27
28 to 44
28 to 32
28 to 44
IC179
IC179
IC179
SMT - oversize footprint (design 1)
SMT - identical footprint (design 3)
SMT - identical footprint and narrow housing (design 5)
TSOP 1.27 32 to 56 IC197 SMT - identical footprint (style200 / 210)

Package Type Pitch (mm) Pin count Series Description
QFP /
TQFP /
BQFP
0.40 to 1.00
44 to 272
 
IC149 Socket series overview
 
ICP 0.40 to 1.00 44 to 272 ICP-**-*

ICP-ext
- PDF only (27KB)
Emulation adapter overview for IC149

Extenter for emulation adapter

QFP 0.05 to 0.80
 
44 to 208
 
IC198


IC198/198A
PDF only 61KB
 
Socket series overview


Insertion and extraction tools
LCC 0.5 to 1.27
0.80
32 to 160
80 only
IC61
ICP
Socket varations in SMT and TH
Emulation adapter for IC61 series
PLCC 1.27
1.27
28 to 84
20 to 84
IC113
IC160
TH - low profile
SMT - 3 terminal style

Package Type Pitch (mm) Pin count Series Description
PGA 1.27
25 to 484
 
YED122 TH - solder dip and wire wrap terminals
 
SPGA 1.27 321 YED210 TH - interstitial
SPGA / ZIF 2.54

 
370
 
NP210T-370
 
Interstitial - ZIF- Intel Celeron (370 pins)
 
BGA 1.27 and 1.50 any YED514 SMT - adapter socket with carrier for BGA

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