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Click on Data Sheet for further
information about:
-Part Number Details
-Socket Dimensions
-IC Dimensions
-PCB Layout
 Full
Data Sheet |
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PDF file size: 101KB |
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Series: IC51 - Clamshell |
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Title: Thin Small Outline Package
(TSOP Type I and II) |
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Features |
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Pitch sizes 0.5, 0.8 and 1.27mm
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Clamshell socket for TSOP Type I and
II
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Specifications |
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Insulation Resistance: |
1,000M
min. at 500V DC |
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Dielec. Withstd. Voltage: |
700V AC for 1 minute |
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Contact Resistance: |
30m
max. at 10mA/20mV max. |
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Operating Temp. Range: |
–40°C to +150°C
(type PSF)
–55°C to +170°C
(type PES & PEI) |
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Mating Cycles: |
10,000 insertions min. |
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Materials and Finish |
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Housing: |
Polysulphone (PSF), glass-filled
Polyethersulphone (PES),
glass- filled
Polyetherimide (PEI), glass-filled |
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Contacts: |
Beryllium Copper (BeCu) |
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Plating: |
Gold over |
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