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Click on Data Sheet for further
information about:
-Part Number Details
-Socket Dimensions
-IC Dimensions
-PCB Layout
Full Data Sheet
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PDF file size: 103KB |
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Series: IC51 - Clamshell |
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Title: Shrink Small
Outline Package (SSOP) |
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Features |
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Pin counts 16, 20, 24, 28,
30, 32, 48 and 56
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Pitch sizes 0.6, 0.635 and
0.65mm
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Clamshell socket for SSOP
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Specifications |
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Insulation Resistance: |
1,000M
min. at 500V DC |
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Dielec. Withstd. Voltage: |
700V AC for 1 minute |
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Contact Resistance: |
30m
max. at 10mA/20mV max. |
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Operating Temp. Range: |
–40°C to +150°C
(type PSF)
–55°C to +170°C
(type PES & PEI) |
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Mating Cycles: |
10,000 insertions min. |
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Materials and Finish |
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Housing: |
Polysulphone (PSF),
glass-filled
Polyethersulphone (PES), glass-
filled
Polyetherimide (PEI),
glass-filled |
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Contacts: |
Beryllium Copper (BeCu) |
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Plating: |
Gold over Nickel |
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