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Click on
Data Sheet for further information about:
-Part Number
Details
-Socket Dimensions
-IC Dimensions
-PCB Layout
Full Data Sheet |
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PDF file size: 93KB |
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Series: IC51 - Clamshell |
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Title: Bumper Quad Flat Package (BQFP) |
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Features |
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Pin counts 100, 132, 164 and 196
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Clamshell socket for BQFP devices
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Specifications |
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Insulation Resistance: |
1,000M
min. at 500V DC |
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Dielec. Withstd. Voltage: |
700C AC for 1minute |
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Contact Resistance: |
30m
max. at 10mA/20mV max. |
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Operating Temp. Range: |
–55°C to +170°C |
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Mating Cycles: |
25,000 insertions min. |
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Contact Force: |
50g min. per pin at min.
displacement of 0.3mm
150g max. per pin at max.
displacement of 0.7mm |
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Materials and Finish |
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Housing: |
Polyetherimide (PEI), glass-filled |
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Contacts: |
Beryllium Copper (BeCu) |
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Plating: |
Gold over Nickel |
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