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Ball Grid Array (BGA) Series

	Open top, zero insertion force suitable for automated load/un–load
	Reliable pinching action contact minimizes solder ball damage
	Small socket outline to maximize burn–in board density and process through–put
	Low actuation force

With their tight pitch and delicate solder balls, testing micro BGA packages presents a complex design challenge. Texas Instruments (TI) has developed a contact design that minimizes solder ball damage and boosts yield.

This approach employs a "pinch" or dual–beam style contact that interfaces the sides of each solder ball at multiple points. Excessive disruption of the package solder ball geometry, on the bottom surface, can lead to assembly and reliability problems farther down the line. By interfacing the non critical sides of each solder ball and incorporating a superior contact design, the socket ensures electrical continuity, minimizes ball deformation, and eliminates potential manufacturing and reliability problems in the end package.

Since TI's burn–in test is cost–effective and available in high volume, manufacturers no longer have to rely on random testing to ensure quality. This non destructive test allows all Micro BGA packages to be tested.

Micro BGA is one of the most dynamic chip scale concepts to date. Its potential is particularly important in the flash memory market, where the demand for increasingly small form–factor packages makes the incumbent TSOP packages prohibitive.
　

Design Features

	Open top auto–load cover actuated socket
	Mechanical contacts touch each solder ball individually and independently
	Contact protrusions pierce oxide on solder ball and give reliable contact
	Contacts touch the upper side of the solder balls to minimize ball damage
	Once the IC package is properly seated in the socket, latches clamp the IC package in position to prevent movement caused by vibration

Spec Overview (See also: CSP Burn–In Testing Chart)

Open–Top Socket Specifications	Socket sizes vary by application 1.0mm 1.27mm 1.5mm
Mechanical Characteristics	Contact system: normally closed Package insertion force: ZIF Contact Force: Approximately 18g/pin typ; 15–21 g/pin range Durability: 10,000 cycles min. Temperature range: -55°C to 150°C Contact point: side of solder ball Maximum acceptable IC shift: ±1.0 mm in x or y axis Actuation Force: 3kg, typical
Electrical Characteristics	Current rating: 1 amp/pin Insulation resistance: 1000mohms at 500V DC Dielectric withstand voltage: for 1 minute at 700V AC Contact resistance: 50mohm max. at 10mA initial, 1 ohm max at 10mA after 10,000 cycles Inductance: 6nH (approximate) at 50 MHz
Product Availability	Variety of pitch sockets available in: 1.0 mm 1.27 mm 1.5mm

Specifications for BGA Packages

Pin Count	IC Package		Pitch	IC Ball		Grid
Pin Count	Width	Length	Pitch	Diameter	Height	X	Y
48	10.00	12.00	1.00	0.45	0.3	6	8
552	31.00	31.00	1.00	0.60	0.5	29	29
648	35.00	35.00	1.00	0.60	0.5	33	33
836	33.00	33.00	1.00	0.60	0.5	31	31
119	22.00	14.00	1.27	0.75	0.6	17	7
119	22.00	14.00	1.27	0.78	0.6	17	7
153	22.00	14.00	1.27	0.78	0.6	17	9
255	26.90	26.90	1.27	0.75	0.6	20	20
256	27.00	27.00	1.27	0.70	0.6	20	20
256	27.00	27.00	1.27	0.76	0.6	20	20
292	27.00	27.00	1.27	0.76	0.6	20	20
304	31.00	31.00	1.27	0.75	0.6	23	23
329	31.00	31.00	1.27	0.78	0.6	23	23
352	35.00	35.00	1.27	0.75	0.6	26	26
352	35.00	35.00	1.27	0.75	0.75	26	26
384	27.00	27.00	1.27	0.75	0.6	20	20
384	37.50	37.50	1.27	0.75	0.6	28	28
385	31.00	31.00	1.27	0.75	0.6	26	23
388	35.00	35.00	1.27	0.78	0.6	26	26
456	35.00	35.00	1.27	0.75	0.6	26	26
477	41.00	41.00	1.27	0.75	0.6	31	31
480	35.00	35.00	1.27	0.75	0.6	26	26
492	35.00	35.00	1.27	0.75	0.6	26	26
516	35.00	35.00	1.27	0.75	0.6	26	26
784	37.50	37.50	1.27	0.76	0.6	28	28
Pin Count	Width	Length	Pitch	Diameter	Height	X	Y
Pin Count	IC Package		Pitch	IC Ball		Grid

Ti BGA测试座