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Ti SOP测试座
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Small Outline
Package (SOP) Series
Chart of Small Outline Package
(SOP) Series
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Zero insertion force and self–alignment
of IC package for automatic loader/unloader
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High reliability in operation with
special contact design
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Open body construction for efficient
heat radiation of IC package
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Specifications
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Current Rating
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Max. 1 Amp
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Insulation
Resistance
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Min. 1,000 M ohm
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Dielectric Strength
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AC 700 V-RMS / 1 Min
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Initial Contact
Resistance
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Max. 30m ohm at DC 10mA
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Operating
Temperature
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-65°C to +150°C
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Durability
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Min. 10,000 Cycles
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Pin Availability
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No. of Pos.
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Pitch mm
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Package Width mil
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8
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1.27
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173
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10
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1.27
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224
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16
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1.27
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320
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24
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0.65
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236
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28
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0.55
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8mm
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28
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1.27
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331
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32
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1.27
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346
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32
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1.27
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331
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28
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1.27
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346
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32
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1.27
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421
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32
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1.27
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445
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32
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1.27
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450
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36
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0.80
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331
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No. of Pos.
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Pitch mm
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Package Width mil
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40
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0.80
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331
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40
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1.27
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421
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40
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1.27
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445
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40
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1.27
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449
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42
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0.80
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331
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44
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1.27
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496
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44
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1.27
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512
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44
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1.27
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520
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44
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1.27
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524
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64
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0.80
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445
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64
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0.80
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454
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64
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0.80
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472
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70
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0.50
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390
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NUMBERING
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1 =
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Series Name
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2 =
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Pin Numbers
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3 =
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Variation
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Contact Finish: Gold Plating
- 10µ"
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Body Material: PEI Glass
Filled
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