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Small
Outline J–Leaded Packages (SOJ Series)
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Compact
design and small foot print ensure high density
mounting on the board
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High
reliability with compound spring contact
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Zero
insertion force to realize easy handling of IC
package in operation
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Automatic machine applicable for loading/unloading
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Open top
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Specifications
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Current Rating
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Max. 1 Amp
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Insulation Resistance
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Min. 1,000 M ohm
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Dielectric Strength
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AC 1,000 V-RMS / 1 Min
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Initial Contact Resistance
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Max. 30m ohm at DC 10mA
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Operating Temperature
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-65°C to +150°C
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Durability
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Min. 10,000 Cycles
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Pin Availability
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No. of Pos.
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A
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B
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C
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D
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E
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Mil
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IC Insertion
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2026
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22.70
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15.24
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14.50
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17.60
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13.78
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300
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2026A
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22.70
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15.24
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15.37
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17.60
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13.78
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300
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24B
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21.43
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13.97
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15.37
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16.33
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13.78
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300
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2426
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22.70
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15.24
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14.50
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17.60
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13.78
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300
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Dead
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26
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22.70
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15.24
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14.50
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17.60
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13.78
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300
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Bug
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2426B
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22.70
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15.24
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15.37
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17.60
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13.78
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300
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26B
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22.70
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15.24
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15.37
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17.60
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13.78
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300
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NUMBERING
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1 =
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Series Name
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2 =
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Body Material-AA: PEI Glass Filled
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3 =
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Contact Finish-33: Gold Plating - 10µ"
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4 =
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Contact Pitch-A: 1.27mm
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5 =
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IC Package Row to Row, 0: 300 mil, A:
350 mil, B: 400 mil
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6 =
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Pin Numbers
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7 =
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Variation:
(Blank) : Socket Height 14.50mm
B : Socket Height 15.37mm
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相关栏目
