|
Compact Size
Compact
sizes maximizes PC board space
TSG (1.27mm pitch) = Device Pkg. Size + 0.216/(5.5mm)
TSH (1.00mm pitch) = Device Pkg. Size + 0.374/(9.5mm)
Specifications
Terminals
Brass; Copper Alloy (C36000)
Terminal
Support
Polyimide Film
Contacts
Beryllium Copper
Plating
(Terminals and Contacts)
G - Gold over Nickel
Spring
Material
Beryllium Copper
Clamp
Assembly
Aluminum
(Heat Sink/Coin Screw, Clamp, Support Plate)
Insulator
Material
Molded PPS (High Temp. Glass Filled Thermoplastic), U.L.
Rated 94V-O, -60°C to 260°C (-76°F to 500°F)
Solder
Ball
Eutectic, 63Sn/37Pb, 183°C (361°F)
|
True BGA SocketTM
1.27mm Pitch Test Data
(rev. 1/8/99) |
|
LOOP
INDUCTANCE (nH) |
|
Frequency |
Avg. |
Max. |
Min. |
|
10
MHz |
1.85 |
2.08 |
1.64 |
|
100
MHz |
1.69 |
1.89 |
1.44 |
|
250
MHz |
3.10 |
3.2 |
2.9 |
|
500
MHz |
2.82 |
2.9 |
2.7 |
|
1
GHz |
2.86 |
3.0 |
2.7 |
|
SELF
INDUCTANCE (nH) |
|
Frequency |
Avg. |
Max. |
Min. |
|
10
MHz |
1.48 |
1.70 |
1.05 |
|
100
MHz |
1.46 |
1.69 |
1.09 |
|
250
MHz |
2.32 |
2.6 |
2.0 |
|
500
MHz |
2.38 |
2.6 |
2.1 |
|
1
GHz |
2.68 |
3.0 |
2.3 |
|
CAPACITANCE (pF) |
|
Frequency |
Avg. |
Max. |
Min. |
|
10
MHz |
1.30 |
1.36 |
1.29 |
|
100
MHz |
1.22 |
1.23 |
1.19 |
|
250
MHz |
1.03 |
1.04 |
1.02 |
|
500
MHz |
1.05 |
1.06 |
1.03 |
|
1
GHz |
0.78 |
0.78 |
0.76 |
|
相关栏目