Pop Top BGA插座系列 - Technical Specifications

Compact Size

Compact design maximizes PCB real estate - only 0.139/(3.52mm)nominal wider than BGA device body size on clamp side.

Specifications

Terminals
Brass; Copper Alloy (C36000), ASTM-B-16

Plating (Terminals and Contacts)
Gold over Nickel

Body Material
Molded PPS (high temp. glass filled thermoplastic), U.L. Rated 94V-0, -60°C to 260°C (-76°F to 500°F)

Contacts
Beryllium Copper; Copper Alloy (C17200), ASTM-B-194

Solder Ball
63Sn/37Pb, Eutectic, 183°C (361.4°F)

Socket Adapter Systems

Test Results for 1.27mm Pitch, Low Force Contacts (P/N 1427-1G) - Test Report No. 92351A

Durability
50 Cycles at 1 inch per minute, followed by Low Level Resistance Test.
3.1 m Ohm Average, +0.1 m Ohm average change

Vibration
MIL-STD 1344, Method 2005 Test, Condition III, 15 G's followed by Low Level Resistance Test.
2.8 m Ohm Average, -0.0 m Ohm average change

Gas Tight
Exposed in a sealed container to concentrated Nitric Acid (NHO3) followed by Low Level Resistance Test.
3.4 m Ohm Average, +0.5 m Ohm average change

Moisture Resistance
Temperature cycling with humidity MIL-STD 1344, Method 1002, Type II, followed by Low Level Resistance Test.
3.4 m Ohm Average, +0.7 m Ohm average change

Shock
MIL-STD 1344, Method 2004, Test Condition A.
No mechanical damage or loss of continuity

Thermal Cycle
MIL-STD 1344, Method 1003, Test Condition A.
3.4 m Ohm Average, +0.7 m Ohm average change

Temperature Life
MIL-STD 1344, Method 1005, Test Condition 2.
3.8 m Ohm Average, +0.8 m Ohm average change

Porosity
MIL-STD 1344, Method 1017
No porosity

Contact Resistance
MIL-STD 1344, Method 3002, measured using 100m amp test current.
3.0 m Ohm average

Contact Force
Initial insertion force: 28.5g average (1.0 oz. average)
Initial withdrawal force: 18.5g average (0.7 oz. average)

Self Inductance*
2.52 nH Average at 1 GHz

Loop Inductance*
2.26 nH Average at 1 GHz