Compact Size

Compact sizes maximizes PC board space
Only 3mm (0.12 inch) wider and 10mm (0.4 inch) longer than the BGA device

Specifications

Terminals
Brass; Copper Alloy (C36000)

Terminal Support
Polyimide Film

Contacts
Beryllium Copper (C17200)

Plating (Terminals and Contacts)
G - Gold over Nickel

Spring Material
Stainless Steel

Heat Sink/Coin Screw and Support Plate Material
Aluminum
　

Insulator, Lid and Latch Material
Molded PPS (High Temp. Glass Filled Thermoplastic), U.L. Rated 94V-O, -60°C to 260°C (-76°F to 500°F)

Solder Ball
Eutectic, 63Sn/37Pb, 183°C (361°F)