SMT models are shipped un-assembled to ease solderability. Thru-hole models are shipped fully assembled.

1. Lower assembly is soldered to PC board with no external hold-down mechanism. Thru-hole models may be soldered to PC board or plugged into a mating socket.
2. Upper assembly inserts easily to lower assembly by aligning guide posts and installing four (supplied) screws.
3. Finned heat sink or coin screw is screwed down to flush position.
4. Lid opens easily by pressing latch.
5. BGA device is inserted by aligning A1 position with chamfered corner of Flip-Top™ socket. Place support plate on top of device, close lid, engage heat sink or coin screw, and socket is ready for use.

Detailed Installation and General Usage Instructions are provided with product.