Compact Size

Standard Adapter
BGA device package + .079 inch (2.0mm)

Extraction Slot Adapter
BGA device package + .157 inch (4.0mm)

Standard Socket
same size as BGA device package

Extraction Socket (1.27mm Pitch and FR-4 1.00mm Pitch)
BGA device package + .079 inch (2.0mm)

Extraction Socket (Molded 1.00mm Pitch)
BGA device package + .138 inch (3.5mm)

Specifications

Terminals
Brass; Copper Alloy (C36000)

Plating (Terminals and Contacts)
Gold over Nickel

Body Material
F - FR-4 glass epoxy, U.L. Rated 94V-0

M (1.27mm Pitch) -Molded PPS (high temp. glass filled thermoplastic), U.L. Rated 94V-0, -60°C to 260°C (-76°F to 500°F)

M (1.00mm Pitch) -Molded LCP (high temp. glass filled thermoplastic), U.L. Rated 94V-0, -40°C to 276°C (-40°F to 528°F)

Contacts
Beryllium Copper; Copper Alloy (C17200)

Standard Solder Ball
63Sn/37Pb, Eutectic, 183°C (361.4°F)

Lead-free Solder Ball
Tin/Silver/Copper Alloy, 218°C (424°F)

Socket Adapter Systems

Test Results for 1.27mm Pitch, Low Force Contacts (P/N 1427-1G) - Test Report No. 92351A

Durability
50 Cycles at 1 inch per minute, followed by Low Level Resistance Test.
3.1 m Ohm Average, +0.1 m Ohm average change

Vibration
MIL-STD 1344, Method 2005 Test, Condition III, 15 G's followed by Low Level Resistance Test.
2.8 m Ohm Average, -0.0 m Ohm average change

Gas Tight
Exposed in a sealed container to concentrated Nitric Acid (NHO3) followed by Low Level Resistance Test.
3.4 m Ohm Average, +0.5 m Ohm average change

Moisture Resistance
Temperature cycling with humidity MIL-STD 1344, Method 1002, Type II, followed by Low Level Resistance Test.
3.4 m Ohm Average, +0.7 m Ohm average change

Shock
MIL-STD 1344, Method 2004, Test Condition A.
No mechanical damage or loss of continuity

Thermal Cycle
MIL-STD 1344, Method 1003, Test Condition A.
3.4 m Ohm Average, +0.7 m Ohm average change

Temperature Life
MIL-STD 1344, Method 1005, Test Condition 2.
3.8 m Ohm Average, +0.8 m Ohm average change

Porosity
MIL-STD 1344, Method 1017
No porosity

Contact Resistance
MIL-STD 1344, Method 3002, measured using 100m amp test current.
3.0 m Ohm average

Contact Force
Initial insertion force: 28.5g average (1.0 oz. average)
Initial withdrawal force: 18.5g average (0.7 oz. average)

Self Inductance*
2.52 nH Average at 1 GHz

Mutual Inductance*
2.26 nH Average at 1 GHz