Advanced Interconnection

New Lead-Free BGA Sockets in 1.00mm Pitch

West Warwick, RI, April 26, 2004 - To comply with the Restriction of Hazardous Substances (RoHS) Directive and other worldwide initiatives for lead-free manufacturing, Advanced is now offering lead-free solder ball terminal options on select BGA Sockets. The new sockets are molded from high temperature, glass filled thermoplastic, able to withstand the higher processing temperatures required in lead-free processing [up to 276°C (528°F)]. Lead-free, 1.00mm pitch, BGA Sockets in precision molded LCP wafers for both surface mount and thru-hole applications are available now. The surface mount sockets feature solder ball terminals made from a tin/silver/copper alloy with a reflow temperature of 218°C (424°F).

The full grid wafers are pin loaded to the exact footprint specified and are available in any footprint specific pattern up to 26 x 26 rows, to accommodate a BGA, LGA, or CSP device as large as 27mm square. Additional sizes and lead-free 1.27mm pitch sockets will be available soon. Advanced's industry proven, screw-machined terminals with multifinger contacts and gold plating ensure long-term durability and superior processing results. Mating adapters, custom designs, and tape and reel packaging are available. Prices vary with number of positions and options selected.