Advanced Interconnection

New Molded 1.00mm Pitch BGA Sockets Offer Improved Processing Benefits

West Warwick, RI, March 22, 2004 - Advanced Interconnections recently introduced 1.00mm pitch BGA Sockets in precision molded wafers. The new sockets are molded in-house from high temperature thermoplastic. Benefits include improved hole-to-hole accuracy, reduced insertion and withdrawal forces, and coplanarity within .006"[0.15mm].

The new, full grid wafers are pin loaded to the exact footprint specified and are available in any footprint specific pattern up to 26 x 26 rows, to accommodate a BGA, LGA, or CSP device as large as 27mm square. Larger sizes are still available in FR-4 wafers and will be available soon in high temperature thermoplastic. The surface mount sockets utilize patented eutectic solder ball terminals. Thru-hole models are available with a variety of terminal options including the popular .011" diameter tail. Advanced's proven screw-machined terminals with multifinger contacts and gold plating ensure long-term durability and superior processing results. The new molded BGA Sockets mate with Advanced's 1.00mm pitch BGA Adapters and are also designed for test applications, enabling a thru-hole test socket to be easily plugged and unplugged for use on multiple test boards.

The 1.00mm pitch molded sockets are available with options such as custom terminal designs, polyimide film seals for automated pick and place, extraction slots to facilitate device/adapter removal, and tape and reel packaging. Prices vary with number of positions and options selected.